by admin | Jun 17, 2026 | Executive Search, Semiconductor Packaging Solutions
NVIDIA’s US$25 billion bond issuance – its first since 2021 – attracted an extraordinary US$85 billion in investor demand, underscoring global confidence in AI infrastructure as the next industrial revolution. Rather than dilute shareholders through...
by admin | Jun 16, 2026 | Executive Search, Semiconductor Packaging Solutions
After years away from the spotlight following US sanctions, Huawei’s legendary “chip queen”, He Tingbo – Huawei Board Director and President of its Semiconductor Business – has re-emerged to unveil the Tau (τ) Scaling Law, signaling a bold new...
by admin | Jun 15, 2026 | Executive Search, Semiconductor Packaging Solutions
SpaceX’s record-breaking IPO raised US$75 billion, making it the largest public offering in history and valuing the company at approximately US$1.77 trillion. Shares debuted at US$135 and closed their first trading day at US$160.95, rising nearly 19% as investors...
by admin | Jun 12, 2026 | Semiconductor Packaging Solutions
Daniel Schall is Co-Founder and Chief Executive Officer of Black Semiconductor, bringing more than 13 years of expertise in graphene photonics, semiconductor fabrication, and advanced computing technologies. Black Semiconductor is developing breakthrough...
