• Home
  • About Us
  • Semiconductor Insights
  • Services
    • Semiconductor Talent Solutions
    • Semiconductor Packaging Solutions
    • Integrated Digital Services
  • Contact Us
India Targets Major Global Semiconductor Hub Status by 2032, Says Union Minister Ashwini Vaishnaw

India Targets Major Global Semiconductor Hub Status by 2032, Says Union Minister Ashwini Vaishnaw

by admin | Jan 15, 2026 | Executive Search

India is accelerating its ambition to become a major global semiconductor hub by 2032, according to Ashwini Vaishnaw, Union Minister for Electronics & Information Technology, Railways, and Communications. The announcement signals a strategic shift as India aligns...
Global Semiconductor Boom 2025: $793B Market Surges 21% Fueled by AI Chip Explosion and Strategic Visionary Leaders

Global Semiconductor Boom 2025: $793B Market Surges 21% Fueled by AI Chip Explosion and Strategic Visionary Leaders

by admin | Jan 14, 2026 | Executive Search

Worldwide semiconductor revenue surged to a record $793 billion in 2025, delivering 21% year-over-year growth, according to Gartner, as AI infrastructure spending reshaped global technology markets. The acceleration reflects a structural shift where AI compute,...
TSMC’s Record-Smashing AI-Fueled Growth: Nvidia-Driven Revenue Beats Estimates, Signals Tech Supercycle Ahead

TSMC’s Record-Smashing AI-Fueled Growth: Nvidia-Driven Revenue Beats Estimates, Signals Tech Supercycle Ahead

by admin | Jan 12, 2026 | Executive Search, Semiconductor Packaging Solutions

TSMC reported a quarterly revenue beat driven primarily by NVIDIA-led AI workloads and advanced-node manufacturing. Q4 revenue rose approximately 20.5% year-on-year to NT$1.046 trillion (US$33.1 billion), fueled by GPUs, AI accelerators, and custom silicon programs....
China Achieves Historic Leap with World’s First Radiation-Resistant FPGA Chip Built on 2D Semiconductors

China Achieves Historic Leap with World’s First Radiation-Resistant FPGA Chip Built on 2D Semiconductors

by admin | Nov 6, 2025 | Semiconductor Packaging Solutions

Chinese researchers at Fudan University have developed a 1-nanometre Field-Programmable Gate Array (FPGA) using molybdenum disulfide (MoS₂) that can withstand radiation levels fatal to conventional silicon chips. This breakthrough marks a major advance in 2D...

As Industry Scales to 12-Inch and Square-Panel Wafers, a 2-Inch Superconducting Germanium Breakthrough Signals Another Material Disruption

by admin | Nov 5, 2025 | Semiconductor Packaging Solutions

While the semiconductor world races toward 12-inch wafers and square-panel formats for high-volume production, researchers at New York University and The University of Queensland discovered superconductivity in a 2-inch gallium-doped germanium wafer using standard...
« Older Entries
Next Entries »

Recent Posts

  • U.S.-Iran Crisis Reaches Beyond the Battlefield: Hidden Semiconductor Costs of Global Conflict
  • Spain vs. Argentina. Semiconductors Power the FIFA World Cup. Even AI Might Have Asked Paul the Octopus.
  • TSMC’s AI Gold Rush Continues: Record Profits Reach New Highs, Adds 2 New CoWoS Plants
  • Singapore’s Economy Grew 5.7% in Q2, Manufacturing Surged 12.2% as Semiconductor Demand Accelerates
  • America’s Semiconductor Renaissance Faces Biggest Challenge: Talent Shortage

Recent Comments

No comments to show.
  • Follow
  • Follow
  • Follow
  • Follow
  • Follow
  • Follow
  • Follow

Office Address

Canberra Crescent, Singapore 752119

Contact Us

  • richard.olivas@tmbsconsulting.com

© Copyright 2024 TMBS Consulting. All Rights Reserved.