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Filtronic Wins $68.1 Million SpaceX Deal: GaN Technology to Power Satellite Communications

Filtronic Wins $68.1 Million SpaceX Deal: GaN Technology to Power Satellite Communications

by admin | Oct 5, 2026 | Executive Search, Semiconductor Packaging Solutions

Filtronic, the UK-based RF and microwave specialist, has secured a record $68.1 million follow-on order from SpaceX for its Cerus E-band gallium nitride (GaN) solid-state power amplifiers (SSPAs), with substantial fulfilment expected in FY2028. Announced on October 1,...

Wafer Baking in Photoresist Photolithography

by admin | Oct 2, 2026 | Breaking News, Uncategorized

https://tmbsconsulting.com/wp-content/uploads/2026/10/What-if-TSMC-built-six-more-advanced-chip-factories-in-Texas-.mp4

TSMC To Build 6 More Fabs in Texas?

by admin | Oct 1, 2026 | Breaking News

TSMC is considering building a second U.S. chip manufacturing hub in Dallas, Texas with up to six factories, adding to its US$265 billion investment in Arizona. With U.S. customers contributing about 75.6% of its revenue in the first half of 2026, the move would help...
TSMC Reaches the Atomic Frontier: The 0.42-Nanometer Interface That Could Redefine Transistor Scaling

TSMC Reaches the Atomic Frontier: The 0.42-Nanometer Interface That Could Redefine Transistor Scaling

by admin | Aug 17, 2026 | Executive Search, Semiconductor Packaging Solutions

Researchers at National Yang Ming Chiao Tung University and TSMC Corporate Research have engineered a 0.42-nanometer aluminum-oxide interface that protects electron transport in monolayer MoS₂ transistors while enabling strong gate control. The work addresses one of...
SPIL’s $3.1 Billion Bet: Taiwan Builds Next Engine of AI Semiconductor Boom with CoWoS, Set to Create 2,000+ Jobs

SPIL’s $3.1 Billion Bet: Taiwan Builds Next Engine of AI Semiconductor Boom with CoWoS, Set to Create 2,000+ Jobs

by admin | Aug 13, 2026 | Executive Search, Semiconductor Packaging Solutions

Siliconware Precision Industries (SPIL), a major semiconductor packaging and testing company and subsidiary of ASE Technology Holding, has commenced construction of a NT$100 billion (US$3.1 billion) advanced chip-packaging plant in Douliou, Yunlin, Taiwan. The...
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Recent Posts

  • Filtronic Wins $68.1 Million SpaceX Deal: GaN Technology to Power Satellite Communications
  • Wafer Baking in Photoresist Photolithography
  • TSMC To Build 6 More Fabs in Texas?
  • TSMC Reaches the Atomic Frontier: The 0.42-Nanometer Interface That Could Redefine Transistor Scaling
  • SPIL’s $3.1 Billion Bet: Taiwan Builds Next Engine of AI Semiconductor Boom with CoWoS, Set to Create 2,000+ Jobs

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