by admin | Aug 12, 2026 | Executive Search, Semiconductor Packaging Solutions
Lam Researchis entering panel-level packaging with a new Panel-Level Packaging Center of Excellence in Salzburg, Austria, a city in western Austria, as AI and high-performance computing drive demand for larger and more complex semiconductor packages. Panel-level...
by admin | Aug 7, 2026 | Executive Search, Semiconductor Packaging Solutions
Chuck McClish is the Founder and Chief Executive Officer of Lattrex Inc., where he is pioneering a new class of asynchronous semiconductor processors designed to overcome the limitations of conventional clock-driven computing. Through Kyttar, his vision is to enable...
by admin | Aug 6, 2026 | Executive Search, Semiconductor Packaging Solutions
A retired SpaceX Falcon 9 rocket has struck the Moon after drifting through deep space for more than a year following the successful completion of its mission, creating a new lunar impact site that scientists are expected to study. The accidental impact is among the...
by admin | Aug 5, 2026 | Uncategorized
The 63rd Design Automation Conference (DAC 2026) gathered the global semiconductor industry from July 26–29, 2026, at the Long Beach Convention Center in Long Beach, California, USA, where the world’s leading experts in Electronic Design Automation (EDA),...
by admin | Aug 3, 2026 | Executive Search, Semiconductor Packaging Solutions
TSMC is advancing its advanced packaging leadership by expanding its CoWoS portfolio with distinct CoWoS-S and CoWoS-R platforms, providing AI chip designers greater flexibility to optimize performance, package size, and manufacturing scalability. As NVIDIA’s...
