by admin | Aug 5, 2026 | Uncategorized
The 63rd Design Automation Conference (DAC 2026) gathered the global semiconductor industry from July 26–29, 2026, at the Long Beach Convention Center in Long Beach, California, USA, where the world’s leading experts in Electronic Design Automation (EDA),...
by admin | Feb 13, 2026 | Uncategorized
Kyle Christopher Borch, CEO of Micro-Mechanics (Holdings) Ltd., is the strategic architect behind a global precision engineering operation spanning Singapore, Malaysia, China, the Philippines, and the United States. Under his leadership, the company designs and...
by admin | Feb 12, 2026 | Uncategorized
SK Hynix is transforming the memory industry with high-bandwidth HBM modules that stack multiple dies to meet the surging demands of AI accelerators, HPC systems, and next-generation data centers. SK Hynix is investing 19 trillion won (about $13 billion) to build a...
by admin | Feb 10, 2026 | Uncategorized
As transistor scaling slows, advanced semiconductor packaging has emerged as the decisive lever for performance, power efficiency, and system-level integration. The SemiconductorX Advanced Packaging Matrix Fan-out technologies such as InFO, FOWLP, and WLCSP are...
