Insights
Gain expert insights to navigate the complexities of today’s talent landscape, semiconductor innovation, and digital marketing strategies.
Daniel Schall, Black Semiconductor CEO: Reimagining Computing Through Graphene-Powered Chip Connectivity
Daniel Schall is Co-Founder and Chief Executive Officer of Black Semiconductor, bringing more than 13 years of expertise in graphene photonics, semiconductor fabrication, and advanced computing technologies. Black Semiconductor is developing breakthrough...
Semicon Giant Applied Materials Opens US$500m Singapore Plant, Adds 1,000 Jobs
Malaysia 2026 Semiconductor Exports to Hit US$197 Billion
Malaysia Semiconductor Industry Association (MSIA) President Wong Siew Hai, speaking to Bloomberg's Haslinda Amin from the sidelines of Invest Malaysia in Kuala Lumpur, believes the country's semiconductor exports can reach approximately US$197 billion (RM835 billion)...
Kyle Christopher Borch, Micro-Mechanics CEO: The Architect of Precision in a World of Infinite Scale
Kyle Christopher Borch leads Micro-Mechanics in delivering precision components that enhance semiconductor yield, efficiency, and performance while shaping talent development and global manufacturing excellence.
Semiconductor Advanced Packaging: Inside the Matrix Powering AI, Chiplets, and Manufacturing
Semiconductor advanced packaging is transforming AI, chiplet integration, and manufacturing economics. Explore key technologies, market trends, and rising talent demand across Asia-Pacific.
SK Hynix: Advancing High-Bandwidth Memory (HBM) for the Future of Compute
SK Hynix is transforming the memory industry with high-bandwidth HBM modules that stack multiple dies to meet the surging demands of AI accelerators, HPC systems, and next-generation data centers. SK Hynix is investing 19 trillion won (about $13 billion) to build a...
Inside the Advanced Packaging Matrix Powering the Future of AI, Chiplets, and Semiconductor Manufacturing
As transistor scaling slows, advanced semiconductor packaging has emerged as the decisive lever for performance, power efficiency, and system-level integration. The SemiconductorX Advanced Packaging Matrix Fan-out technologies such as InFO, FOWLP, and WLCSP are...
2nm Race Propelling Semiconductor Power, Profit, and Global Leadership
The race toward 2 nm process technology is intensifying, led by TSMC, Samsung, and Intel, powering next-generation AI, cloud, and mobile platforms while shaping global competitiveness. From the 10 µm transistors of the 1970s to today’s 20–50 nm advanced packaging...
Micron Warns Unprecedented DRAM & HBM Shortage, Redefining Semiconductor Supply Chains Beyond 2026
The global semiconductor industry is entering a new phase of constraint as Micron confirms an unprecedented memory shortage extending beyond 2026, driven by explosive AI infrastructure demand. What was once a cyclical DRAM market is now structurally reshaped by AI...
Advanced Packaging Becomes the New Moore’s Law: Why AI Chips Are Scaling Beyond Transistors
The race to build smarter, faster AI chips isn’t just about shrinking transistors anymore — the real breakthrough comes from advanced packaging. By combining chiplets, high-bandwidth memory, and Gate-All-Around transistors, the semiconductor industry is rewriting the...