by admin | Oct 31, 2025 | Semiconductor Packaging Solutions
Cristiano R. Amon, President and CEO of Qualcomm Incorporated, is a visionary leader shaping the future of semiconductor and connectivity technologies worldwide. In August 2025, he was recognized on TIME’s 2025 list of the 100 Most Influential People in AI for leading...
by admin | Oct 30, 2025 | Semiconductor Packaging Solutions
Reports from Reuters and Tom’s Hardware suggest that China’s new DeepSeek-powered autonomous combat drone may be using NVIDIA’s restricted H100 chips, despite U.S. export controls. While not independently verified, the story highlights how semiconductors have become...
by admin | Oct 29, 2025 | Semiconductor Packaging Solutions
The landmark agreement signed by U.S. President Donald Trump and Japanese Prime Minister Sanae Takaichi on rare earths represents a decisive step in building resilient global technology ecosystems....
by admin | Oct 28, 2025 | Semiconductor Packaging Solutions
https://www.linkedin.com/pulse/qualcomm-shares-soar-highest-new-ai-chips-taking-bold-olivas-5szzc/?trackingId=hbjvfmJYQ1%2BKBdU3np32tA%3D%3D Qualcomm’s stock surged more than 10% to its highest level in over a year after unveiling two powerful AI data-center chips—the...
by admin | Oct 27, 2025 | Semiconductor Packaging Solutions
ASE Technology Holding Co., Ltd. is spearheading the evolution of Fan-Out Panel-Level Packaging (FOPLP) and increasingly focusing on Fan-Out Chip-on-Substrate (FOCoS), positioning both as critical enablers of next-generation AI and HPC systems....
by admin | Oct 24, 2025 | Semiconductor Packaging Solutions
Naveen Yanduru, Chief Executive Officer of Axiro Semiconductor, is leading India’s push toward a robust fabless semiconductor ecosystem. Axiro designs and develops advanced RF, analog, and mixed-signal chips using a fabless model, partnering with global manufacturers...
