by admin | Jun 17, 2026 | Executive Search, Semiconductor Packaging Solutions
NVIDIA’s US$25 billion bond issuance – its first since 2021 – attracted an extraordinary US$85 billion in investor demand, underscoring global confidence in AI infrastructure as the next industrial revolution. Rather than dilute shareholders through...
by admin | Jun 16, 2026 | Executive Search, Semiconductor Packaging Solutions
After years away from the spotlight following US sanctions, Huawei’s legendary “chip queen”, He Tingbo – Huawei Board Director and President of its Semiconductor Business – has re-emerged to unveil the Tau (τ) Scaling Law, signaling a bold new...
by admin | Jun 15, 2026 | Executive Search, Semiconductor Packaging Solutions
SpaceX’s record-breaking IPO raised US$75 billion, making it the largest public offering in history and valuing the company at approximately US$1.77 trillion. Shares debuted at US$135 and closed their first trading day at US$160.95, rising nearly 19% as investors...
by admin | Feb 12, 2026 | Executive Search, Semiconductor Packaging Solutions
Introduction As transistor scaling slows and Moore’s Law delivers diminishing returns, semiconductor advanced packaging has emerged as the primary driver of performance, power efficiency, and system-level differentiation. From AI accelerators to chiplet-based...
by admin | Jan 22, 2026 | Executive Search, Semiconductor Packaging Solutions
The global semiconductor industry is entering a new phase of constraint as Micron confirms an unprecedented memory shortage extending beyond 2026, driven by explosive AI infrastructure demand. What was once a cyclical DRAM market is now structurally reshaped by AI...
by admin | Jan 21, 2026 | Executive Search, Semiconductor Packaging Solutions
The race to build smarter, faster AI chips isn’t just about shrinking transistors anymore — the real breakthrough comes from advanced packaging. By combining chiplets, high-bandwidth memory, and Gate-All-Around transistors, the semiconductor industry is rewriting the...
