Excerpts from Bloomberg’s Interview of Sundar Pichai, Google CEO

by admin | Jun 13, 2025 | Semiconductor Packaging Solutions

Sundar Pichai, CEO of Alphabet Inc., was interviewed by Bloomberg’s Executive Editor Emily Chang on June 5, 2025. In the conversation, he shared insights into his personal journey from Chennai, India, to leading one of the world’s most influential technology...

GlobalFoundries Commits $16 Billion to Boost U.S. Chip Production

by admin | Jun 12, 2025 | Semiconductor Packaging Solutions

GlobalFoundries commits $16 billion to boost U.S. chip production, aligning with surging AI demand, national security, and a strategic push for semiconductor supply chain resilience. This bold expansion targets high-demand chip applications across AI, automotive,...

Gallox Semiconductors Secures Prestigious ‘Hello Tomorrow’ Prize for Groundbreaking Gallium Oxide Work

by admin | Jun 11, 2025 | Semiconductor Packaging Solutions

In a significant stride for technological advancement, Gallox Semiconductors, a pioneering startup stemming from Cornell University, has clinched the prestigious 2025 Hello Tomorrow Global Challenge in the Advanced Computing & Electronics category. This...

Intel Upgrades Chip Packaging for Bigger AI, Piles 10,000 Square Millimeters of Silicon into One Package

by admin | Jun 10, 2025 | Semiconductor Packaging Solutions

Intel Corporation, which first introduced its Embedded Multi-die Interconnect Bridge (EMIB) technology in 2017, has since evolved it into EMIB-T – an enhanced version designed for improved testability and scalability in multi-die packaging, particularly for...

Workday: Singapore Businesses Face Skills Gaps in Preparing Workforce for the Future

by admin | Jun 9, 2025 | Executive Search

Singapore’s corporate leaders are raising red flags about workforce readiness as they prepare for long-term economic competitiveness. In a recent Workday study, many organisations report low confidence in their internal talent capabilities, citing skill shortages,...