Insights
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Filtronic Wins $68.1 Million SpaceX Deal: GaN Technology to Power Satellite Communications
Filtronic, the UK-based RF and microwave specialist, has secured a record $68.1 million follow-on order from SpaceX for its Cerus E-band gallium nitride (GaN) solid-state power amplifiers (SSPAs), with substantial fulfilment expected in FY2028. Announced on October 1,...
Wafer Baking in Photoresist Photolithography
TSMC To Build 6 More Fabs in Texas?
TSMC is considering building a second U.S. chip manufacturing hub in Dallas, Texas with up to six factories, adding to its US$265 billion investment in Arizona. With U.S. customers contributing about 75.6% of its revenue in the first half of 2026, the move would help...
TSMC Reaches the Atomic Frontier: The 0.42-Nanometer Interface That Could Redefine Transistor Scaling
TSMC researchers demonstrate a 0.42nm interface for MoS₂ transistors, opening a potential path toward advanced semiconductor scaling.
SPIL’s $3.1 Billion Bet: Taiwan Builds Next Engine of AI Semiconductor Boom with CoWoS, Set to Create 2,000+ Jobs
SPIL’s new $3.1B CoWoS plant highlights the rapid growth of advanced semiconductor packaging for AI chips and the rising need for reliable packaging solutions.
Lam Research Enters Panel-Level Packaging, AI Sparks New Packaging Era
Lam Research is advancing semiconductor metallization to help overcome scaling challenges and enable the next generation of AI chips, advanced logic, and memory technologies.
Chuck McClish, Lattrex CEO, Reinvents Real-Time Signal Processing with Clockless Semiconductor Architecture
Chuck McClish, Founder & CEO of Lattrex, believes the future of AI computing lies beyond conventional clock-driven processors. Discover how Kyttar’s clockless, massively parallel architecture could transform semiconductor innovation, AI performance, and next-generation computing.
SpaceX Falcon 9 Rocket Strikes the Moon: Not an AI Moonshot, But a New Era of Semiconductor Innovation
A retired SpaceX Falcon 9 rocket has struck the Moon after drifting through deep space for more than a year, creating a new lunar impact site for scientific study. Beyond the headline, the event underscores why semiconductor innovation and advanced packaging will play an increasingly important role in enabling future lunar exploration and space technologies.
What It Really Takes to Build an AI Chip: Inside the World’s Most Complex Engineering Challenge
DAC 2026 showcased the latest breakthroughs in AI chip innovation, Electronic Design Automation (EDA), and semiconductor engineering. Discover how next-generation chip design is reshaping the industry and driving unprecedented demand for specialized semiconductor talent.
TSMC’s Advanced Packaging Revolution: CoWoS-S vs. CoWoS-R
TSMC’s latest CoWoS-S and CoWoS-R technologies are redefining advanced semiconductor packaging for AI. Learn how silicon interposers, redistribution layers, HBM integration, and heterogeneous chiplet architectures are shaping the next generation of AI computing.