Insights
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Qualcomm Shares Soar Highest with New AI Chips, Taking a Bold Swipe at NVIDIA
https://www.linkedin.com/pulse/qualcomm-shares-soar-highest-new-ai-chips-taking-bold-olivas-5szzc/?trackingId=hbjvfmJYQ1%2BKBdU3np32tA%3D%3D Qualcomm’s stock surged more than 10% to its highest level in over a year after unveiling two powerful AI data-center chips—the...
ASE Powers Advanced Packaging for AI/HPC: From FOPLP to FOCoS
ASE Technology Holding Co., Ltd. is spearheading the evolution of Fan-Out Panel-Level Packaging (FOPLP) and increasingly focusing on Fan-Out Chip-on-Substrate (FOCoS), positioning both as critical enablers of next-generation AI and HPC systems....
Naveen Yanduru, Axiro CEO, Pushes for More Fabless in India to Strengthen Country’s Semiconductor Industry
Naveen Yanduru, Chief Executive Officer of Axiro Semiconductor, is leading India’s push toward a robust fabless semiconductor ecosystem. Axiro designs and develops advanced RF, analog, and mixed-signal chips using a fabless model, partnering with global manufacturers...
ASE Buys Analog Devices Malaysia, Enters Strategic Partnership
ASE Technology Holding Co has acquired Analog Devices Malaysia and entered a strategic partnership with Analog Devices Inc (ADI) to expand advanced IC packaging and manufacturing cooperation....
US, Australia Ink Rare Earths Deal, Fortifying Semiconductor Supply Chain Anew
In a pivotal move, the US and Australia have committed over $2B in near-term investment toward joint development of rare earths and critical minerals projects — directly supporting materials essential to the semiconductor and advanced packaging industries. As supply...
Nvidia’s Jensen Huang, TSMC Celebrate First US-Made Blackwell Chip
The landmark unveiling of the first U.S.-manufactured Nvidia Blackwell AI chip — produced at TSMC’s Arizona facility — signals a decisive step in America’s semiconductor resurgence. It reflects how technology leadership, supply-chain localization, and strategic...
Beyond Moore’s Law: KAUST Scientists Build World’s First Six-Layer Hybrid Microchip
Scientists at KAUST (King Abdullah University of Science and Technology) (KAUST) have achieved a groundbreaking milestone - developing the world’s first six-layer hybrid CMOS chip. This innovation signals a decisive shift in how the semiconductor industry approaches...
Dr. Avi Madisetti, Mixed-Signal Devices CEO & Founder, Reinventing Timing Solutions for Modern Technologies
Dr. Avi Madisetti, a visionary in semiconductor engineering, leads Mixed-Signal Devices, a company redefining the landscape of timing solutions. Under his leadership, the company delivers ultra-low jitter, multi-gigahertz CMOS-based timing platforms, empowering the...
Oracle Pledges Widespread Use of AMD AI Chips, Targeting Deployment of at Least 50,000 Units by Q3 2026
AMD and Oracle have announced that Oracle will deploy 50,000 of AMD’s next-generation MI450 AI chips beginning in Q3 2026, signaling a deepening alliance in the race for large-scale AI infrastructure. This move underscores the intensifying competition in...
Trần Kim Chung – Powering Vietnam’s Rise in the Global Chip Supply Chain
Tran Kim Chung, Chairman of CT Group, is leading Vietnam’s most ambitious push into the global semiconductor ecosystem. CT Group is a diversified conglomerate now pioneering Outsourced Semiconductor Assembly and Test (OSAT) operations to position Vietnam as a...