by admin | Jul 24, 2025 | Semiconductor Packaging Solutions
SK hynix reported its strongest quarter to date, with operating profit hitting 9.2 trillion won (USD 6.69 billion) and revenue reaching 22.2 trillion won (USD 16.14 billion), thanks to soaring AI-driven demand for memory chips. The company is accelerating investment...
by admin | Jul 23, 2025 | Semiconductor Packaging Solutions
Japanese startup Rapidus has successfully demonstrated early prototypes of its 2nm transistors, signaling progress toward its ambitious goal of launching full-scale production by 2027. The company, backed by Japan’s government and major corporates, aims to reposition...
by admin | Jul 22, 2025 | Semiconductor Packaging Solutions
Nexperia and TU Hamburg have launched an endowed professorship in power-electronic devices to accelerate SiC, GaN, and AlScN semiconductor development and strengthen talent pipelines for energy-efficient innovations. This strategic partnership will drive next-gen...
by admin | Jul 21, 2025 | Semiconductor Packaging Solutions
Intel’s leadership is intensifying the AI semiconductor battle, with interim CEOs David Zinsner and Michelle Johnston Holthaus executing strategic plays to reclaim market share from Nvidia. The company is betting big on Gaudi accelerators, advanced packaging, and...
by admin | Jul 21, 2025 | Semiconductor Packaging Solutions
A groundbreaking new approach from MIT spinout CDIMENSIONS could revolutionize 2D transistor design, reshaping the future of post-Moore’s Law computing. Developed through a multi-university collaboration, this innovation sets new efficiency benchmarks for the...
by admin | Jul 18, 2025 | Semiconductor Packaging Solutions
Darin Davis, CEO of SILICET LLC – a semiconductor IP licensing firm specializing in innovative LDMOS architectures. SILICET develops and licenses advanced LDMOS IP that enhances transistor performance, reliability, and cost-efficiency for BCD processes. Davis’s...
