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From FinFET to Gate-All-Around Devices: Atomic-Level Simulation Unlocks the Future of Chip Innovation

From FinFET to Gate-All-Around Devices: Atomic-Level Simulation Unlocks the Future of Chip Innovation

by admin | Sep 22, 2025 | Semiconductor Packaging Solutions

Transistor technology is at a turning point as the world races to design faster, smaller, and more energy-efficient chips. With global competition intensifying, atomic-level simulation is proving to be the hidden engine powering the shift from FinFET to...
Shariman Jamil – From Silicon Valley to Sarawak: Vision for Malaysia’s Chip Future

Shariman Jamil – From Silicon Valley to Sarawak: Vision for Malaysia’s Chip Future

by admin | Sep 19, 2025 | Semiconductor Packaging Solutions

Shariman Jamil, Chief Executive Officer of SMD Semiconductor, leads Malaysia’s only state-backed design house dedicated to building a full semiconductor design ecosystem in Sarawak. SMD Semiconductor develops chip IP, trains design engineers, and builds industry...
Luc Van den Hove, CEO of imec: Driving Global AI Through Nanoelectronics and Digital Tech

Luc Van den Hove, CEO of imec: Driving Global AI Through Nanoelectronics and Digital Tech

by admin | Sep 12, 2025 | Semiconductor Packaging Solutions

Luc Van den hove, President & Chief Executive Officer of imec, leads Europe’s premier nanoelectronics and digital technologies research organization. imec drives cutting-edge semiconductor R&D, from AI-ready architectures to health and smart-city applications....
IBM, AMD Forge Alliance to Develop Quantum-Centric Supercomputing

IBM, AMD Forge Alliance to Develop Quantum-Centric Supercomputing

by admin | Sep 11, 2025 | Digital Marketing, Executive Search, Semiconductor Packaging Solutions

IBM and AMD have announced a strategic partnership to develop quantum-centric supercomputing architectures, aiming to integrate quantum computing with high-performance computing (HPC) and AI accelerators. This collaboration seeks to tackle complex problems beyond the...
Trump Meets Tech Giants, Discuss AI and Semiconductor Investments at White House Dinner

Trump Meets Tech Giants, Discuss AI and Semiconductor Investments at White House Dinner

by admin | Sep 8, 2025 | Semiconductor Packaging Solutions

At a high-stakes White House dinner on September 4, 2025, President Trump met with America’s most powerful tech leaders to discuss AI, semiconductors, and domestic infrastructure. The gathering highlighted the escalating competition to secure supply chains and fuel...
China’s Xi, Russia’s Putin, and North Korea’s Kim Unite in Beijing; Trump on Sidelines as Alliance Reshapes Global Defense, Electronic Warfare

China’s Xi, Russia’s Putin, and North Korea’s Kim Unite in Beijing; Trump on Sidelines as Alliance Reshapes Global Defense, Electronic Warfare

by admin | Sep 5, 2025 | Executive Search, Semiconductor Packaging Solutions

A powerful convergence in Beijing signals a new axis of influence, as China’s Xi Jinping welcomed Russia’s Vladimir Putin and North Korea’s Kim Jong Un in a show of unity that challenges Western dominance. Their coordinated display of military might,...
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