by admin | Aug 3, 2026 | Executive Search, Semiconductor Packaging Solutions
TSMC is advancing its advanced packaging leadership by expanding its CoWoS portfolio with distinct CoWoS-S and CoWoS-R platforms, providing AI chip designers greater flexibility to optimize performance, package size, and manufacturing scalability. As NVIDIA’s...
by admin | Jul 30, 2026 | Executive Search
According to the Semiconductor Industry Association (SIA) 2026 State of the U.S. Semiconductor Industry Report, worldwide semiconductor sales are projected to approach US$1.5 trillion in 2026 after reaching a record US$795.6 billion in 2025. Supported by record...
by admin | Jul 20, 2026 | Executive Search, Semiconductor Packaging Solutions
The United States and Iran entered another dangerous phase of their conflict as military operations intensified over the weekend, raising concerns over the security of the Strait of Hormuz and global energy supplies. Oil prices climbed while commercial shipping...
by admin | Jul 16, 2026 | Executive Search, Semiconductor Packaging Solutions
Argentina battles Spain in the FIFA World Cup Final, with billions of fans around the world eagerly awaiting one of the biggest sporting spectacles of the year. While the spotlight will be on the action on the pitch, the tournament also demonstrates how semiconductor...
by admin | Jul 15, 2026 | Executive Search, Semiconductor Packaging Solutions
TSMC continues to dominate the global AI semiconductor race after June revenue surged 67.9% year-over-year to a record NT$443 billion (US$13.79 billion), underscoring the relentless pace of AI infrastructure investments worldwide. The remarkable growth reflects...
by admin | Jul 14, 2026 | Executive Search, Semiconductor Packaging Solutions
Singapore’s economy exceeded expectations by growing 5.7% year-on-year in the second quarter of 2026, while manufacturing surged 12.2%, reinforcing the nation’s position as one of Asia’s leading advanced manufacturing economies. Beyond the...