Oracle Pledges Widespread Use of AMD AI Chips, Targeting Deployment of at Least 50,000 Units by Q3 2026

by admin | Oct 16, 2025 | Semiconductor Packaging Solutions

AMD and Oracle have announced that Oracle will deploy 50,000 of AMD’s next-generation MI450 AI chips beginning in Q3 2026, signaling a deepening alliance in the race for large-scale AI infrastructure. This move underscores the intensifying competition in...

Trần Kim Chung – Powering Vietnam’s Rise in the Global Chip Supply Chain

by admin | Oct 3, 2025 | Semiconductor Packaging Solutions

Tran Kim Chung, Chairman of CT Group, is leading Vietnam’s most ambitious push into the global semiconductor ecosystem. CT Group is a diversified conglomerate now pioneering Outsourced Semiconductor Assembly and Test (OSAT) operations to position Vietnam as a...

Nvidia Soars to Record $4.5 Trillion Valuation, Investors Rush Into Teradyne

by admin | Oct 2, 2025 | Executive Search, Semiconductor Packaging Solutions

AI infrastructure is driving an unprecedented boom in semiconductors, with NVIDIA hitting a record-breaking $4.5 trillion valuation that cements its dominance in the global tech landscape. At the same time, investor attention is spilling over into Teradyne and other...

The Rise of HBM4 in AI: Breaking the Memory Wall

by admin | Oct 1, 2025 | Semiconductor Packaging Solutions

HBM4 is on track to enter volume production between late 2025 and 2026, marking a new era of high-bandwidth memory for AI applications. TrendForce, a global market research firm covering semiconductors and AI hardware, highlights how this leap will intensify...

U.S. Mulls 1:1 Rule on Domestic vs. Imported Chips – Implications for the Semiconductor Supply Chain

by admin | Sep 30, 2025 | Semiconductor Packaging Solutions

The U.S. is reportedly weighing a new “1:1 rule” that would require chip makers to match domestic production to their imported volumes – a move that could reshape global supply chains and give preferential treatment to major foundries. OEMs and supply chain...