China Achieves Historic Leap with World’s First Radiation-Resistant FPGA Chip Built on 2D Semiconductors

by admin | Nov 6, 2025 | Semiconductor Packaging Solutions

Chinese researchers at Fudan University have developed a 1-nanometre Field-Programmable Gate Array (FPGA) using molybdenum disulfide (MoS₂) that can withstand radiation levels fatal to conventional silicon chips. This breakthrough marks a major advance in 2D...

As Industry Scales to 12-Inch and Square-Panel Wafers, a 2-Inch Superconducting Germanium Breakthrough Signals Another Material Disruption

by admin | Nov 5, 2025 | Semiconductor Packaging Solutions

While the semiconductor world races toward 12-inch wafers and square-panel formats for high-volume production, researchers at New York University and The University of Queensland discovered superconductivity in a 2-inch gallium-doped germanium wafer using standard...

Amazon, OpenAI Forge Game-Changing $38 Billion AI Compute Alliance Powered by NVIDIA GPUs

by admin | Nov 4, 2025 | Semiconductor Packaging Solutions

Amazon Web Services (AWS) and OpenAI have entered a landmark $38 billion multi-year alliance to expand global AI compute capacity using NVIDIA’s most advanced GPUs. The partnership signals a new phase in the AI infrastructure race where compute power, cloud...

Warren Buffett’s Berkshire Hathaway Amasses Record $381.7 B Cash War Chest, Gains Big from Tech & AI Sector Investments

by admin | Nov 3, 2025 | Semiconductor Packaging Solutions

Warren Buffett’s Berkshire Hathaway has raised its cash reserves to a historic $381.7 billion, signaling unparalleled liquidity and strategic foresight. This milestone highlights Buffett’s disciplined investing style and shows how selective exposure to technology and...

Cristiano R. Amon, Qualcomm President & CEO: Company’s Vision for India, AI, 6G, and 100% User Empowerment, Hailed on TIME100 AI Most Influential

by admin | Oct 31, 2025 | Semiconductor Packaging Solutions

Cristiano R. Amon, President and CEO of Qualcomm Incorporated, is a visionary leader shaping the future of semiconductor and connectivity technologies worldwide. In August 2025, he was recognized on TIME’s 2025 list of the 100 Most Influential People in AI for leading...