by admin | Oct 27, 2025 | Semiconductor Packaging Solutions
ASE Technology Holding Co., Ltd. is spearheading the evolution of Fan-Out Panel-Level Packaging (FOPLP) and increasingly focusing on Fan-Out Chip-on-Substrate (FOCoS), positioning both as critical enablers of next-generation AI and HPC systems....
by admin | Oct 24, 2025 | Semiconductor Packaging Solutions
Naveen Yanduru, Chief Executive Officer of Axiro Semiconductor, is leading India’s push toward a robust fabless semiconductor ecosystem. Axiro designs and develops advanced RF, analog, and mixed-signal chips using a fabless model, partnering with global manufacturers...
by admin | Oct 23, 2025 | Executive Search, Semiconductor Packaging Solutions
ASE Technology Holding Co has acquired Analog Devices Malaysia and entered a strategic partnership with Analog Devices Inc (ADI) to expand advanced IC packaging and manufacturing cooperation....
by admin | Oct 22, 2025 | Semiconductor Packaging Solutions
In a pivotal move, the US and Australia have committed over $2B in near-term investment toward joint development of rare earths and critical minerals projects — directly supporting materials essential to the semiconductor and advanced packaging industries. As supply...
by admin | Oct 21, 2025 | Executive Search, Semiconductor Packaging Solutions
The landmark unveiling of the first U.S.-manufactured Nvidia Blackwell AI chip — produced at TSMC’s Arizona facility — signals a decisive step in America’s semiconductor resurgence. It reflects how technology leadership, supply-chain localization, and strategic...
by admin | Oct 20, 2025 | Semiconductor Packaging Solutions
Scientists at KAUST (King Abdullah University of Science and Technology) (KAUST) have achieved a groundbreaking milestone – developing the world’s first six-layer hybrid CMOS chip. This innovation signals a decisive shift in how the semiconductor industry...
