by admin | Jan 21, 2026 | Executive Search, Semiconductor Packaging Solutions
The race to build smarter, faster AI chips isn’t just about shrinking transistors anymore — the real breakthrough comes from advanced packaging. By combining chiplets, high-bandwidth memory, and Gate-All-Around transistors, the semiconductor industry is rewriting the...
by admin | Jan 15, 2026 | Executive Search
India is accelerating its ambition to become a major global semiconductor hub by 2032, according to Ashwini Vaishnaw, Union Minister for Electronics & Information Technology, Railways, and Communications. The announcement signals a strategic shift as India aligns...
by admin | Jan 14, 2026 | Executive Search
Worldwide semiconductor revenue surged to a record $793 billion in 2025, delivering 21% year-over-year growth, according to Gartner, as AI infrastructure spending reshaped global technology markets. The acceleration reflects a structural shift where AI compute,...
by admin | Jan 12, 2026 | Executive Search, Semiconductor Packaging Solutions
TSMC reported a quarterly revenue beat driven primarily by NVIDIA-led AI workloads and advanced-node manufacturing. Q4 revenue rose approximately 20.5% year-on-year to NT$1.046 trillion (US$33.1 billion), fueled by GPUs, AI accelerators, and custom silicon programs....
by admin | Nov 6, 2025 | Semiconductor Packaging Solutions
Chinese researchers at Fudan University have developed a 1-nanometre Field-Programmable Gate Array (FPGA) using molybdenum disulfide (MoS₂) that can withstand radiation levels fatal to conventional silicon chips. This breakthrough marks a major advance in 2D...
