by admin | Oct 30, 2025 | Semiconductor Packaging Solutions
Reports from Reuters and Tom’s Hardware suggest that China’s new DeepSeek-powered autonomous combat drone may be using NVIDIA’s restricted H100 chips, despite U.S. export controls. While not independently verified, the story highlights how semiconductors have become...
by admin | Oct 29, 2025 | Semiconductor Packaging Solutions
The landmark agreement signed by U.S. President Donald Trump and Japanese Prime Minister Sanae Takaichi on rare earths represents a decisive step in building resilient global technology ecosystems....
by admin | Oct 28, 2025 | Semiconductor Packaging Solutions
https://www.linkedin.com/pulse/qualcomm-shares-soar-highest-new-ai-chips-taking-bold-olivas-5szzc/?trackingId=hbjvfmJYQ1%2BKBdU3np32tA%3D%3D Qualcomm’s stock surged more than 10% to its highest level in over a year after unveiling two powerful AI data-center chips—the...
by admin | Oct 27, 2025 | Semiconductor Packaging Solutions
ASE Technology Holding Co., Ltd. is spearheading the evolution of Fan-Out Panel-Level Packaging (FOPLP) and increasingly focusing on Fan-Out Chip-on-Substrate (FOCoS), positioning both as critical enablers of next-generation AI and HPC systems....
by admin | Oct 24, 2025 | Semiconductor Packaging Solutions
Naveen Yanduru, Chief Executive Officer of Axiro Semiconductor, is leading India’s push toward a robust fabless semiconductor ecosystem. Axiro designs and develops advanced RF, analog, and mixed-signal chips using a fabless model, partnering with global manufacturers...
