by admin | Jun 11, 2025 | Semiconductor Packaging Solutions
In a significant stride for technological advancement, Gallox Semiconductors, a pioneering startup stemming from Cornell University, has clinched the prestigious 2025 Hello Tomorrow Global Challenge in the Advanced Computing & Electronics category. This...
by admin | Jun 10, 2025 | Semiconductor Packaging Solutions
Intel Corporation, which first introduced its Embedded Multi-die Interconnect Bridge (EMIB) technology in 2017, has since evolved it into EMIB-T – an enhanced version designed for improved testability and scalability in multi-die packaging, particularly for...
by admin | Jun 9, 2025 | Executive Search
Singapore’s corporate leaders are raising red flags about workforce readiness as they prepare for long-term economic competitiveness. In a recent Workday study, many organisations report low confidence in their internal talent capabilities, citing skill shortages,...
by admin | Jun 9, 2025 | Semiconductor Packaging Solutions
Senior trade teams from the US and China reconvene in London on June 9, aiming to reset rare-earth export dynamics and stabilize technology supply sensitivities. The revival of talks offers a significant opportunity to reinforce semiconductor supply chains through...
by admin | Jun 7, 2025 | Semiconductor Packaging Solutions
April marked a solid turning point for the semiconductor industry, with worldwide chip sales growing 2.5% month-on-month to reach $46.4 billion. Amid global economic headwinds and ongoing inventory corrections, the data shows promising signs of resilience and renewed...
