Nexperia and TU Hamburg Launch Power Electronics Chair to Drive WBG Semiconductor Research

by admin | Jul 22, 2025 | Semiconductor Packaging Solutions

Nexperia and TU Hamburg have launched an endowed professorship in power-electronic devices to accelerate SiC, GaN, and AlScN semiconductor development and strengthen talent pipelines for energy-efficient innovations. This strategic partnership will drive next-gen...

Intel CEO Leads AI Chip Tech War on Battlefield Against Nvidia’s Stronghold

by admin | Jul 21, 2025 | Semiconductor Packaging Solutions

Intel’s leadership is intensifying the AI semiconductor battle, with interim CEOs David Zinsner and Michelle Johnston Holthaus executing strategic plays to reclaim market share from Nvidia. The company is betting big on Gaudi accelerators, advanced packaging, and...

CDIMENSIONS Advances 2D Transistors Beyond Moore’s Law

by admin | Jul 21, 2025 | Semiconductor Packaging Solutions

A groundbreaking new approach from MIT spinout CDIMENSIONS could revolutionize 2D transistor design, reshaping the future of post-Moore’s Law computing. Developed through a multi-university collaboration, this innovation sets new efficiency benchmarks for the...

SILICET CEO Darin Davis Transforms LDMOS Design, Redefines Power Transistors in the Semiconductor Industry

by admin | Jul 18, 2025 | Semiconductor Packaging Solutions

Darin Davis, CEO of SILICET LLC – a semiconductor IP licensing firm specializing in innovative LDMOS architectures. SILICET develops and licenses advanced LDMOS IP that enhances transistor performance, reliability, and cost-efficiency for BCD processes. Davis’s...

Nvidia Secures China Export Green Light as U.S. Reverses AI Chip Ban

by admin | Jul 16, 2025 | Semiconductor Packaging Solutions

NVIDIA CEO Jensen Huang has successfully persuaded U.S. authorities to lift restrictions on the company’s H20 AI accelerator exports to China, pivoting a hardline trade stance into a strategic win after talks spanning Washington, Geneva, and London. The decision...