SK Hynix Achieves Record Profit and Sales as AI Demand Powers DRAM & NAND Chip Expansion

by admin | Jul 24, 2025 | Semiconductor Packaging Solutions

SK hynix reported its strongest quarter to date, with operating profit hitting 9.2 trillion won (USD 6.69 billion) and revenue reaching 22.2 trillion won (USD 16.14 billion), thanks to soaring AI-driven demand for memory chips. The company is accelerating investment...

Rapidus Advances 2nm Transistor Prototypes for 2027 Semiconductor Production Ramp

by admin | Jul 23, 2025 | Semiconductor Packaging Solutions

Japanese startup Rapidus has successfully demonstrated early prototypes of its 2nm transistors, signaling progress toward its ambitious goal of launching full-scale production by 2027. The company, backed by Japan’s government and major corporates, aims to reposition...

Nexperia and TU Hamburg Launch Power Electronics Chair to Drive WBG Semiconductor Research

by admin | Jul 22, 2025 | Semiconductor Packaging Solutions

Nexperia and TU Hamburg have launched an endowed professorship in power-electronic devices to accelerate SiC, GaN, and AlScN semiconductor development and strengthen talent pipelines for energy-efficient innovations. This strategic partnership will drive next-gen...

Intel CEO Leads AI Chip Tech War on Battlefield Against Nvidia’s Stronghold

by admin | Jul 21, 2025 | Semiconductor Packaging Solutions

Intel’s leadership is intensifying the AI semiconductor battle, with interim CEOs David Zinsner and Michelle Johnston Holthaus executing strategic plays to reclaim market share from Nvidia. The company is betting big on Gaudi accelerators, advanced packaging, and...

CDIMENSIONS Advances 2D Transistors Beyond Moore’s Law

by admin | Jul 21, 2025 | Semiconductor Packaging Solutions

A groundbreaking new approach from MIT spinout CDIMENSIONS could revolutionize 2D transistor design, reshaping the future of post-Moore’s Law computing. Developed through a multi-university collaboration, this innovation sets new efficiency benchmarks for the...